Plastic Packages National Semiconductor offers a wide variety of plastic packages for through-hole and surface mount applications. Many of these plastic packages provide cost-effective solutions to achieving greater board density (surface-mount packages) and high performance. Plastic packages are extensively used in commercial applications. Today National offers molded plastic packages. The primary materials used in a plastic package are a leadframe, die attach material, bond wire, mold compound and a lead finish. In order to provide plastic package solutions which do not sacrifice reliability or functionality, National continues to improve on the materials used, whether focusing on leadframe composition for increased thermal conductivity or low stress mold compound used for large die applications or low moisture absorption mold compounds for improved reliability. (c) 2000 National Semiconductor Corporation MS011797 National offers through hole DIP configurations in the molded dual-in-line package (MDIP) style. Other through hole package styles include the plastic pin grid array (PPGA) packages and various plastic TOs. Many plastic surface mount packages are offered by National. Various plastic TO packages are formed for surface mount application (TO-263). Dual-in-line packages such as the small outline package (SOP), the shrink small outline package (SSOP), the thin small outline package (TSOP) and the thin shrink small outline package (TSSOP) are available in lower lead counts. Applications requiring higher density and increased lead count use quad packages such as the plastic leaded chip carrier (PLCC), the plastic quad flatpak (PQFP) and the thin plastic quad pack package(TQFP). Recent improvements in the surface mount packages include exposed pad thin packages for improved thermal and electrical performance. These packages have the same footprint as the standard thin packages. Other improvements include the introduction of the small body size packages such as the SOT-23, SOT-223 and the SC-70 package outlines The following table provides configuration and characteristic data regarding each of the plastic package offered by National. www.national.com Plastic Packages August 1999 Plastic Packages Package Configuration Package Characteristics Plastic Small Outline Transistor (SOT-23) Plastic Small Outline Package (SOP) * * * * Surface Mount Package * * * * * * Surface Mount Package * * * * * Surface Mount Package Gull Wing Lead Configuration Solder Plate Lead Finish Molded Package Gull Wing Lead Configuration Solder Plate Lead Finish Molded Package EIAJ and JEDEC Package Styles Footprint Compatible with Ceramic Small Outline Package (SOIC) Narrow Body Wide Body Plastic Shrink Small Outline Package (SSOP) Gull Wing Lead Configuration Solder Plate Lead Finish Molded Package EIAJ and JEDEC Package Styles Plastic Thin Small Outline Package, Type I (TSOP) * * * * * www.national.com 2 Surface Mount Package Gull Wing Lead Configuration Solder Plate Lead Finish Molded Package EIAJ Package Style Plastic Packages Package Configuration Package Characteristics Plastic Thin Shrink Small Outline Package (TSSOP) * * * * * Surface Mount Package * * * * Through Hole Package Gull Wing Lead Configuration Solder Plate Lead Finish Molded Package EIAJ Package Styles Molded Dual-In-Line Package (MDIP) Solder Plate or Solder Dip Lead Finish Molded Package Footprint Compatible with Ceramic Sidebrazed Dual-In-Line Package (SB and Cerdip) * Can be Thermally Enhanced * Half Lead Package Option Plastic Pin Grid Array (PPGA) * * * * Through Hole Package * * * * * Surface Mount Package Solder DIP Lead Finish Molded Package Footprint Compatible CPGA Plastic Leaded Chip Carrier (PLCC) J-Bend Lead Configuration Solder Plate Lead Finish Molded Package Footprint Compatible with Ceramic Leadless Chip Carrier (LCC) and Ceramic Quad J-Bend (CQJB) * Can be Thermally Enhanced 3 www.national.com Plastic Packages Package Configuration Package Characteristics Plastic Quad Flatpak (PQFP) TO-92 * * * * * * Surface Mount Package * * * Through Hole Package * * * Through Hole Package or Chassis Mounting * * * * Through Hole Package or Chassis Mounting * * * Through Hole Package * * * Through Hole Package Gull Wing Lead Configuration Solder Plate Lead Finish Molded Package Can be Thermally Enhanced High Density Package Application Solder Plate Lead Finish Molded Plastic Package TO-202 TO-220 Solder Plate Lead Finish Molded Plastic Package Solder Plate Lead Finish Molded Plastic Package Designed with Heat Sink for High Power Applications TO-226 TO-237 www.national.com 4 Solder Plate Lead Finish Molded Plastic Package Solder Plate Lead Finish Molded Plastic Package Plastic Packages LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Francais Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.